What’s the cheapest package that will work?
By Javier DeLaCruz, So often, I come across questions from customers asking what’s the lowest cost package technology that will work. The package by itself should not be the singular focus when...
View ArticleA Refreshing Opportunity
By Jack Harding Fifteen years after its debut as a silicon strategy the SoC is finally in full bloom worldwide. In its simplest configuration it consists of a processor, memory, I/O and the RTL crafted...
View ArticleThe Turning Point
By Javier DeLaCruz In the epic battle of cost and performance, MCMs (multi-chip modules) had generally lost to SoCs (systems on chip) due to higher package-assembly costs and lower performance. The...
View ArticleThe Current State Of 3D Stacking
By Javier DeLaCruz Thru-silicon-vias (TSVs) have become a very hot topic in in recent months. Ever since Xilinx reported that it is using a 2.5D TSV approach for its Virtex-7 FPGAs the industry started...
View ArticleTurning Chaos Into Order
By Jack Harding It would be unthinkable to begin this article without recognition of the disaster the Japanese people are enduring, even as this is written. My friends and colleagues are as safe as...
View ArticleThe Future Of ASICS In 3D
By Javier DeLaCruz 3D technology is generating a lot of interest as a way to reduce NRE costs and speed time to market. This is still a nascent approach, so people are looking for a single standard in...
View ArticleTurducken Lessons
By Doug Ridge So with the U.S. holiday season just having passed, it seemed that the topic of discussion and of many a holiday feast was the now infamous turducken. Yes, the somewhat crazy idea of...
View ArticleWhen Stacked Die Make Sense
By Javier DeLaCruz There are two general flavors of 3D-TSV technology. Images for these can be seen in the previous blog entry The Future of ASICs in 3D. 3D-IC has vias in silicon containing active...
View ArticleThe New ASIC
By Javier DeLaCruz The current state of the art For years, large ASICs like the ones used in network processing, supercomputing and high-end personal computing have had very interesting similarities....
View ArticleStacking The Deck
By Javier DeLaCruz The pinnacle of system-on-chip has passed. There are several dynamics that are moving the industry away from the SoC philosophy that was so popular just a few short years ago. One of...
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